Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
1～15 item / All 16 items
Using carefully selected high-purity alumina.
Our alumina substrates are produced using carefully selected high-purity alumina raw materials and under strict quality control, ensuring consistently stable quality and excellent properties.
A high thermal conductivity material approximately 70 times greater than FR-4! Introducing a substrate with excellent Q.C.D.
"Alumina substrate" is a common ceramic material used for substrates and has excellent Q.C.D. It is approximately 70 times more thermally conductive than FR-4, providing sufficient cooling effects for mounted components. It is also possible to pattern resistors in any shape, and it can be manufactured as a heat source (high-temperature heater substrate). [Features] ■ High heat resistance (over 300°C) ■ High thermal conductivity (25W/m·K) ■ Low thermal expansion (7.2×10^−6) ■ High solvent resistance ■ High degree of freedom in substrate shape (three-dimensional shapes are also possible) ■ Inorganic material *For more details, please refer to the PDF document or feel free to contact us.
![[Processing Material Example] Alumina Substrate ver](https://image.mono.ipros.com/public/product/image/15f/2000719377/IPROS17612683730815401846.png?w=280&h=280)
Excellent surface condition with smoothness and flatness! Widely used as IC substrates and semiconductor package elements.
"Alumina substrate" is a substrate made from alumina-based ceramics, which excels in mechanical strength, electrical insulation, corrosion resistance, heat resistance, and thermal conductivity. Its physical and chemical properties remain stable even in high-temperature environments. There is minimal variation in dimensions such as outer shape, thickness, slit pitch, and slit depth, resulting in low warping, bending, and waviness. It can be used for chip resistor substrates, HIC substrates, thin-film circuit substrates, and more. 【Features】 ■ A surface condition with few pores due to fine particles, excellent smoothness and flatness ■ Excellent adhesion to thick-film and thin-film materials ■ Stable physical and chemical properties even in high-temperature environments ■ A thermal expansion coefficient close to silicon, with high thermal conductivity ■ High-strength substrates with increased strength are also available *For more details, please refer to the PDF document or feel free to contact us.
Ideal for thin film circuit formation! JFC's unique alumina substrate with high strength, high purity, and excellent planar smoothness.
The high-strength alumina substrates for thin films manufactured by our company feature a dense and smooth surface achieved through the use of fine and uniform raw powder, making them suitable for the formation of fine thin film circuits. Due to their high purity and bending strength, they are resistant to cracking even when the substrates are made thin, and they excel in handling, contributing to the miniaturization and thinning of the substrates. They are increasingly being adopted for temperature sensors and chip resistors.
